Business profile
IceMOS Technology Corporation, established in 2004, is a global leader in the manufacturing of high-quality SOI wafers and advanced engineering substrates. Specializing in Wafer Bonding, Deep Reactive Ion Etch (DRIE), and wafer shaping, IceMOS focuses on providing cost-effective, high-performance solutions in various semiconductor domains, including Super-Junction MOSFETs, and MEMS solutions.